A connector assembly includes a housing, a signal contact and a power contact. The housing has a mounting body and a mating body coupled together and separated by a gap. The gap permits air to flow between the lower and mating bodies. The mating body is configured to engage an upper substrate and the mounting body is configured to engage a lower substrate to mechanically interconnect the upper and lower substrates. The signal contact extends between and protrudes from the mating and mounting bodies and is configured to communicate a data signal between the mating and mounting bodies. The power contact extends between and protrudes from the mating and mounting bodies and is configured to communicate electrical power between the upper and lower substrates. The housing separates the upper and lower substrates by a predetermined stack height.