发明授权
US07737463B2 Light emitting diode package with a heat sink support ring and having multiple molding resins, wherein secondary molding resin with higher hardness than primary molding resin and which covers primary molding resin that covers LED die
有权
具有散热器支撑环并具有多个模制树脂的发光二极管封装，其中具有比初始模塑树脂更高的硬度的二次模塑树脂并且覆盖覆盖LED模具的初级模塑树脂
- 专利标题： Light emitting diode package with a heat sink support ring and having multiple molding resins, wherein secondary molding resin with higher hardness than primary molding resin and which covers primary molding resin that covers LED die
- 专利标题（中）： 具有散热器支撑环并具有多个模制树脂的发光二极管封装，其中具有比初始模塑树脂更高的硬度的二次模塑树脂并且覆盖覆盖LED模具的初级模塑树脂
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申请号： US12196028申请日： 2008-08-21
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公开(公告)号： US07737463B2公开(公告)日： 2010-06-15
- 发明人: Chung Hoon Lee , Do Hyung Kim , Keon Young Lee
- 申请人： Chung Hoon Lee , Do Hyung Kim , Keon Young Lee
- 申请人地址： KR Seoul
- 专利权人： Seoul Semiconductor Co., Ltd.
- 当前专利权人： Seoul Semiconductor Co., Ltd.
- 当前专利权人地址： KR Seoul
- 代理机构： H.C. Park & Associates, PLC
- 优先权： KR2004-0072452 20040910; KR2004-0079909 20041007; KR2005-0000269 20050103
- 主分类号： H01L29/00
- IPC分类号： H01L29/00 ; H01L23/04 ; H01L23/34
摘要：
Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals and a heat sink inserted into a heat sink support ring. At least portions of the pair of lead terminals and the heat sink are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.
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