发明授权
US07737490B2 Vertical and trench type insulated gate MOS semiconductor device 有权
垂直和沟槽型绝缘栅MOS半导体器件

Vertical and trench type insulated gate MOS semiconductor device
摘要:
A vertical and trench type insulated gate MOS semiconductor device is provided in which the surfaces of p-type channel regions and the surfaces of portions of an n-type semiconductor substrate alternate in the longitudinal direction of the trench between the trenches arranged in parallel, and an n+-type emitter region selectively formed on the surface of the p-type channel region is wide by the side of the trench and becomes narrow toward the center point between the trenches. This enables the device to achieve low on-resistance and enhanced turn-off capability.
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