Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
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Application No.: US11979809Application Date: 2007-11-08
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Publication No.: US07737538B2Publication Date: 2010-06-15
- Inventor: Chao-Chen Chen , Lin-Gi Yang , Chia-Chi Chou , Shih-Chieh Teng
- Applicant: Chao-Chen Chen , Lin-Gi Yang , Chia-Chi Chou , Shih-Chieh Teng
- Applicant Address: TW Hsinchu
- Assignee: VisEra Technologies Company Limited
- Current Assignee: VisEra Technologies Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/00
Abstract:
A semiconductor package. The semiconductor package of the invention comprises: a substrate comprising at least one exposed area with photosensitive devices; a cover for isolating the exposed area from the external atmosphere, wherein one of either the substrate or the cover is a base, and the other is a top structure; and a dam formed on the base to form a cavity, wherein the top of the dam has a recess, the dam is attached the top structure by an adhesive, and the cavity corresponds to the exposed area.
Public/Granted literature
- US20090121303A1 Semiconductor package Public/Granted day:2009-05-14
Information query
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