发明授权
- 专利标题： Multi-surface IC packaging structures and methods for their manufacture
- 专利标题（中）： 多表面IC封装结构及其制造方法
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申请号： US11353564申请日： 2006-02-13
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公开(公告)号： US07737545B2公开(公告)日： 2010-06-15
- 发明人: Joseph C. Fjelstad , Para K. Segaram , Thomas J. Obenhuber , Kevin P. Grundy
- 申请人： Joseph C. Fjelstad , Para K. Segaram , Thomas J. Obenhuber , Inessa Obenhuber, legal representative , Kevin P. Grundy
- 申请人地址： US CA Cupertino
- 专利权人： Interconnect Portfolio LLC
- 当前专利权人： Interconnect Portfolio LLC
- 当前专利权人地址： US CA Cupertino
- 代理商 Ronald R. Shea, Esq.
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
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