发明授权
- 专利标题: Mounting apparatus for mounting circuit board
- 专利标题(中): 电路板安装装置
-
申请号: US12137777申请日: 2008-06-12
-
公开(公告)号: US07742286B2公开(公告)日: 2010-06-22
- 发明人: Guang-Yi Zhang , Zhe Zhang
- 申请人: Guang-Yi Zhang , Zhe Zhang
- 申请人地址: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 专利权人: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 代理商 D. Austin Bonderer
- 优先权: CN200710203041 20071213
- 主分类号: H05K7/12
- IPC分类号: H05K7/12
摘要:
A mounting apparatus includes a bottom plate, a bracket fixed to the bottom plate, and a clamp rotatably mounted to the bottom plate. The bracket includes a first and a second mounting piece. The second mounting piece defines a mounting groove for receiving an edge of a circuit board. The first mounting piece includes a mounting portion, and a fixing piece extending from the mounting portion. The mounting portion includes a post for engaging in a hole of the circuit board. The fixing piece defines a clamping hole. The clamp includes an elastic piece, and a plurality of clips. The elastic piece is configured to move with the clamp to insert through the clamping hole and catch the first mounting piece. The clips are configured to move with the clamp to clip the circuit board to the fixing piece.
公开/授权文献
- US20090154118A1 MOUNTING APPARATUS FOR MOUNTING CIRCUIT BOARD 公开/授权日:2009-06-18