发明授权
US07745924B2 Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer
有权
嵌入在插入器中的电容器，包括其的半导体器件以及嵌入在插入器中的制造电容器的方法
- 专利标题： Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer
- 专利标题（中）： 嵌入在插入器中的电容器，包括其的半导体器件以及嵌入在插入器中的制造电容器的方法
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申请号： US12129889申请日： 2008-05-30
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公开(公告)号： US07745924B2公开(公告)日： 2010-06-29
- 发明人: Takeshi Shioga , Masataka Mizukoshi , Kazuaki Kurihara
- 申请人： Takeshi Shioga , Masataka Mizukoshi , Kazuaki Kurihara
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2007-224659 20070830
- 主分类号： H01L23/485
- IPC分类号： H01L23/485
摘要：
As for electrode pads for a semiconductor integrated circuit element, some of electrode pads for signal transmission are coupled to Ti films. Others of the electrode pads for signal transmission are coupled to electrode pads through wiring routed in multilayer wiring. Electrode pads for power supply are coupled to electrode pads to which power lines at potentials different from each other are coupled through wiring. The electrode pads are also coupled to Al foils (anodes). Electrode pads for grounding are coupled to electrode pads to which ground lines are coupled through wiring. The electrode pads are also coupled to conductive polymer films (cathodes).