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发明授权
US07746656B2 Offset integrated circuit package-on-package stacking system 有权
封装集成电路封装堆叠系统

Offset integrated circuit package-on-package stacking system
摘要：
An offset integrated circuit package-on-package stacking system is provided including providing a base substrate, providing an array of contact pads on the base substrate, mounting an active component and an optional passive component on the base substrate, injecting a mold cap on the base substrate, mounting an offset package on the base substrate and the mold cap, and singulating a package-on-package from the base substrate.
摘要（中）：

提供了一种偏移集成电路封装堆叠堆叠系统，包括提供基底基板，在基底基板上提供接触焊盘的阵列，将有源部件和可选的无源部件安装在基底基板上，将模具帽 在基底基板和模具盖上安装偏移封装，以及从基底基板上单独封装封装。

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