发明授权
US07748323B2 Semiconductor bridge device and igniter including semiconductor bridge circuit device
失效
半导体桥接器件和点火器,包括半导体桥接电路器件
- 专利标题: Semiconductor bridge device and igniter including semiconductor bridge circuit device
- 专利标题(中): 半导体桥接器件和点火器,包括半导体桥接电路器件
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申请号: US11664462申请日: 2005-10-04
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公开(公告)号: US07748323B2公开(公告)日: 2010-07-06
- 发明人: Shigeru Maeda , Hirotaka Mukunoki
- 申请人: Shigeru Maeda , Hirotaka Mukunoki
- 申请人地址: JP
- 专利权人: Nipponkayaku Kabushikikaisha
- 当前专利权人: Nipponkayaku Kabushikikaisha
- 当前专利权人地址: JP
- 代理机构: Dickstein Shapiro LLP
- 优先权: JP2004-290993 20041004
- 国际申请: PCT/JP2005/018718 WO 20051004
- 国际公布: WO2006/038703 WO 20060413
- 主分类号: F42B3/10
- IPC分类号: F42B3/10
摘要:
There is provided a semiconductor bridge device wherein a reaction time for generating sparks is short and a spark generating amount is large. This semiconductor bridge device comprises a substrate, a pair of land portions, a bridge portion electrically connecting between the pair of the land portions, and an electrode pad arranged on each upper surface in the pair of the land portions and emitting sparks at the bridge portion through an electric current passed between the electrode pads, in which the pair of the land portions and the bridge portion consist of a laminate formed by alternately laminating a metal layer and a metal oxide layer plural times, and an outermost layer in the laminate is a metal layer, and a metal oxide having a decomposition temperature of higher than 1500° C. is used in the metal oxide layer.
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