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发明授权
US07749336B2 Technique for increasing the compliance of tin-indium solders 有权
提高锡铟焊料顺应性的技术

Technique for increasing the compliance of tin-indium solders
摘要：
A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.
摘要（中）：

公开了一种提高锡铟焊料顺从性的技术。 在一个具体的示例性实施方案中，该技术可以实现为无铅焊料合金，其包含约58.0重量％至约99.998重量％的锡，约0.001重量％至约40.0重量％的铟和约0.001重量％至约2.0重量％ 重量％至少一种稀土元素。

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