发明授权
- 专利标题： Photosensitive composition and pattern forming method using the same
- 专利标题（中）： 光敏组合物和使用其的图案形成方法
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申请号： US11085482申请日： 2005-03-22
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公开(公告)号： US07749678B2公开(公告)日： 2010-07-06
- 发明人: Tsukasa Yamanaka
- 申请人： Tsukasa Yamanaka
- 申请人地址： JP Tokyo
- 专利权人： FUJIFILM Corporation
- 当前专利权人： FUJIFILM Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2004-082679 20040322
- 主分类号： G03F7/00
- IPC分类号： G03F7/00 ; G03F7/004
摘要：
A photosensitive composition comprising (A) a resin that is decomposed by the action of an acid to increase solubility in an alkali developing solution, (B) a compound that generates an acid upon irradiation of an actinic ray or radiation, and (C1) a compound having a molecular weight of 1,000 or less and containing an aliphatic ring and an aromatic ring, and a photosensitive composition comprising (A) a resin that is decomposed by the action of an acid to increase solubility in an alkali developing solution, (B) a compound that generates an acid upon irradiation of an actinic ray or radiation, and (C2) a resin containing a hydroxystyrene unit; and a pattern forming method using these photosensitive composition.
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