发明授权
- 专利标题： Method for sawing a wafer and method for manufacturing a semiconductor package by using a multiple-type tape
- 专利标题（中）： 锯切晶圆的方法及使用多型胶带制造半导体封装的方法
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申请号： US12017931申请日： 2008-01-22
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公开(公告)号： US07749866B2公开(公告)日： 2010-07-06
- 发明人: Fu Tang Chu , Chi Yuam Chung
- 申请人： Fu Tang Chu , Chi Yuam Chung
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 优先权： TW96102445A 20070123
- 主分类号： H01L21/301
- IPC分类号： H01L21/301
摘要：
A method for sawing a wafer includes the following steps. A wafer which has an active surface, a back surface and a plurality of longitudinal and transverse sawing lines is provided, wherein the sawing lines are located on the active surface so as to define a plurality of dies. A multiple-type tape is attached on the active surface of the wafer, wherein the multiple-type tape includes a first tape and a second tape, the second tape is located between the first tape and the active surface of the wafer, and the second tape is transparent. The back surface of the wafer is grinded. The first tape is removed. Finally, the wafer including the second tape is sawn along the sawing lines so as to separate the dies from one another.
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