发明授权
US07750459B2 Integrated module for data processing system 有权
数据处理系统集成模块

Integrated module for data processing system
摘要:
An apparatus for an integrated module. A silicon carrier with through-silicon vias has a plurality of die connected to a top side of the silicon carrier. In addition, a substrate is connected to a bottom side of the silicon carrier. The substrate is coupled to the plurality of die via the through-silicon vias.
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