A socket connector, for electrically connecting an IC package and a printed circuit board, comprises a base having a plurality of through holes, a cover mounted on the base and having a top plate, a plurality of wire-shape contacts bent from a metal haulm and an adapter assembled below the base. The contact has a contacting portion inserting into the top plate of the cover, a tail retained to the base and an elastic center portion connecting the contacting portion and the tail, the center portion is located between the base and the top plate of the cover. The adapter receives the tails of the contacts and has a plurality of exposed solder balls electrically connecting the tails.