发明授权
- 专利标题： Electrical contact with C-shaped spring portion interconnecting upper contacting arm portion and lower soldering leg
- 专利标题（中）： 与连接上接触臂部分和下焊道的C形弹簧部分电接触
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申请号： US12154305申请日： 2008-05-22
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公开(公告)号： US07753704B2公开(公告)日： 2010-07-13
- 发明人: Ming-Yue Chen
- 申请人： Ming-Yue Chen
- 申请人地址： TW Taipei Hsien
- 专利权人： Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人： Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人地址： TW Taipei Hsien
- 代理商 Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- 优先权： CN200720037867 20070522
- 主分类号： H01R11/22
- IPC分类号： H01R11/22
摘要：
An electrical contact (5) adapted for connection a BGA device to a PCB includes a pair of arm portions defining a pair of clamping portions (51, 52) at top ends thereof for corresponding solder balls of the BGA device, a C-shaped spring portion (53) extending from a bottom end of one arm portion (51) and a contacting portion (54) extending from a free end of the spring portion for touch the PCB. The spring portion opens perpendicularly to the arm portions.
公开/授权文献
- US20080293279A1 Electrical connector having improved contacts 公开/授权日：2008-11-27
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