发明授权
- 专利标题： Film formation method and manufacturing equipment for forming semiconductor layer
- 专利标题（中）： 用于形成半导体层的成膜方法和制造设备
-
申请号： US11595388申请日： 2006-11-09
-
公开(公告)号： US07754525B2公开(公告)日： 2010-07-13
- 发明人: Jun Yamada , Masakazu Okada , Mitsuyoshi Miyai
- 申请人： Jun Yamada , Masakazu Okada , Mitsuyoshi Miyai
- 申请人地址： JP Tokyo
- 专利权人： Konica Minolta Holdings Inc.
- 当前专利权人： Konica Minolta Holdings Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： Brinks Hofer Gilson & Lione
- 优先权： JP2005-328588 20051114
- 主分类号： H01L51/40
- IPC分类号： H01L51/40
摘要：
The present invention provides a film forming method of a uniform semiconductor layer having a large area at a low cost and equipment to form said semiconductor layer, by blowing gas against a coated layer to shorten the drying time and to decrease uneven drying. A film forming method of a semiconductor layer characterized by being provided, after a process to coat a semiconductor material containing a solvent on a substrate, with a process to blow gas against a coated layer of a semiconductor layer containing said solvent to evaporate the solvent.
公开/授权文献
信息查询
IPC分类:
