发明授权
US07754997B2 Apparatus and method to confine plasma and reduce flow resistance in a plasma
失效
限制等离子体并降低等离子体反应器中的流动阻力的装置和方法
- 专利标题： Apparatus and method to confine plasma and reduce flow resistance in a plasma
- 专利标题（中）： 限制等离子体并降低等离子体反应器中的流动阻力的装置和方法
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申请号： US11924086申请日： 2007-10-25
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公开(公告)号： US07754997B2公开(公告)日： 2010-07-13
- 发明人: Kallol Bera , Yan Ye , James D. Carducci , Daniel J. Hoffman , Steven C. Shannon , Douglas A. Buchberger, Jr.
- 申请人： Kallol Bera , Yan Ye , James D. Carducci , Daniel J. Hoffman , Steven C. Shannon , Douglas A. Buchberger, Jr.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Pattersib & Sheridan, LLP
- 主分类号： B23K9/00
- IPC分类号： B23K9/00
摘要：
An apparatus configured to confine a plasma within a processing region in a plasma processing chamber. In one embodiment, the apparatus includes a ring that has a baffle having a plurality of slots and a plurality of fingers. Each slot is configured to have a width less than the thickness of a plasma sheath contained in the processing region.