发明授权
- 专利标题: Flip-chip flow sensor
- 专利标题(中): 倒装流量传感器
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申请号: US11412460申请日: 2006-04-26
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公开(公告)号: US07755466B2公开(公告)日: 2010-07-13
- 发明人: Scott E. Beck , Gilberto Morales
- 申请人: Scott E. Beck , Gilberto Morales
- 申请人地址: US NJ Morristown
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: US NJ Morristown
- 主分类号: H01C3/04
- IPC分类号: H01C3/04
摘要:
A flip-chip flow sensor has electrical components, such as temperature sensors and a heater, on the top of a substrate and has a channel formed in the bottom of the substrate. The channel is separated from the substrate's top by a membrane of substrate material. A fluid flowing through the channel is separated from a heater, upstream temperature sensor, downstream temperature sensor, bond pads, and wire bonds by the membrane. Heat flows through the membrane easily because the membrane is thin. As such, the electrical elements of the flow sensor, the bond pads and the wires are physically separated from a fluid flowing through the channel but can function properly because they are not thermally isolated.
公开/授权文献
- US20070251292A1 Flip-chip flow sensor 公开/授权日:2007-11-01