发明授权
- 专利标题： Encapsulating packets for network chip conduit port
- 专利标题（中）： 封装网络芯片管道端口的数据包
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申请号： US11088394申请日： 2005-03-23
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公开(公告)号： US07756124B2公开(公告)日： 2010-07-13
- 发明人: Bruce E. LaVigne , John A. Wickeraad , Lewis S. Kootstra , Jonathan M. Watts
- 申请人： Bruce E. LaVigne , John A. Wickeraad , Lewis S. Kootstra , Jonathan M. Watts
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： H04L12/50
- IPC分类号： H04L12/50 ; H04Q11/00 ; H04L12/28 ; H04J1/02
摘要：
Systems, methods, and devices are provided for moving packets on a network device. One method includes receiving packets to a number of network chips, the number of network chips having a conduit port which can be selectively chosen to exchange packets with a processor responsible for processing packets. The method includes adding data for additional functionality to certain packets. Adding data includes encapsulating the certain packets to maintain an appearance of a certain packet format.
公开/授权文献
- US20060215653A1 Encapsulating packets for network chip conduit port 公开/授权日：2006-09-28
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