发明授权
- 专利标题: Anterior plating system and method
- 专利标题(中): 前电镀系统及方法
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申请号: US10913766申请日: 2004-08-06
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公开(公告)号: US07758616B2公开(公告)日: 2010-07-20
- 发明人: Jean-Charles LeHuec , Mingyan Liu , Loic Josse
- 申请人: Jean-Charles LeHuec , Mingyan Liu , Loic Josse
- 申请人地址: US IN Warsaw
- 专利权人: Warsaw Orthopedic, Inc.
- 当前专利权人: Warsaw Orthopedic, Inc.
- 当前专利权人地址: US IN Warsaw
- 优先权: FR0104728 20010406
- 主分类号: A61B17/70
- IPC分类号: A61B17/70
摘要:
Systems and methods for stabilizing the spine are provided. For stabilizing the L5-S1 junction, the system includes a plate that has a generally triangular shape with an upper node and a pair of lower nodes. The upper node has a hole through the plate to receive a screw for passage into the L5 vertebra. The lower nodes each include a hole through the plate to receive screws for passage into the S1 vertebra. The system further includes a plate having a retaining element for preventing backout of screws inserted through the plate. Instruments and methods for attaching the plate to the spinal column are also provided.
公开/授权文献
- US20050027293A1 Anterior plating system and method 公开/授权日:2005-02-03
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