Invention Grant
- Patent Title: Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules
- Patent Title (中): LED和其他光电模块的经济型小型化组装和连接技术
-
Application No.: US10579542Application Date: 2004-10-27
-
Publication No.: US07759754B2Publication Date: 2010-07-20
- Inventor: Ewald Gunther , Jorg-Erich Sorg , Karl Weidner , Jorg Zapf
- Applicant: Ewald Gunther , Jorg-Erich Sorg , Karl Weidner , Jorg Zapf
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Dickstein Shapiro LLP
- Priority: DE10353679 20031117
- International Application: PCT/EP2004/052676 WO 20041027
- International Announcement: WO2005/050746 WO 20050602
- Main IPC: H01L31/113
- IPC: H01L31/113
Abstract:
An economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules is provided. A manufactured item in accordance with this technology includes a substrate with an optoelectronic component contacted in a planar manner.
Public/Granted literature
- US20070190290A1 Economical minaturized assembly and connection technology for leds and other optoelectronic modules Public/Granted day:2007-08-16
Information query
IPC分类:
