Invention Grant
- Patent Title: Apparatus, system, and method for integrated component testing
- Patent Title (中): 用于集成组件测试的装置,系统和方法
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Application No.: US11859540Application Date: 2007-09-21
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Publication No.: US07759958B2Publication Date: 2010-07-20
- Inventor: Moises Cases , Shiva R. Dasari , Erdem Matoglu , Bhyrav M. Mutnury , Nam H. Pham
- Applicant: Moises Cases , Shiva R. Dasari , Erdem Matoglu , Bhyrav M. Mutnury , Nam H. Pham
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Kunzler Needham Massey & Thorpe
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G06F17/50

Abstract:
An apparatus, system, and method are disclosed for integrating component testing. A voltage module modifies a reference voltage integral to an electronic device to a plurality of reference voltage values. A test module tests a component of the electronic device at each of the plurality of reference voltage values. In addition, the test module determines a voltage range for the component, wherein the voltage range comprises voltage values between a high voltage failure and a low voltage failure. An optimization module sets the reference voltage value to within the voltage range.
Public/Granted literature
- US20090079456A1 APPARATUS, SYSTEM, AND METHOD FOR INTEGRATED COMPONENT TESTING Public/Granted day:2009-03-26
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