Invention Grant
- Patent Title: Fabrication of semiconductor devices
- Patent Title (中): 半导体器件的制造
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Application No.: US10593107Application Date: 2005-03-01
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Publication No.: US07763477B2Publication Date: 2010-07-27
- Inventor: Shu Yuan , Xuejun Kang
- Applicant: Shu Yuan , Xuejun Kang
- Applicant Address: SG Singapore
- Assignee: Tinggi Technologies Pte Limited
- Current Assignee: Tinggi Technologies Pte Limited
- Current Assignee Address: SG Singapore
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: SG200401424-7 20040315
- International Application: PCT/SG2005/000061 WO 20050301
- International Announcement: WO2005/088743 WO 20050922
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/15 ; H01L31/12 ; H01L33/00

Abstract:
A method for fabrication of a semiconductor device, the semiconductor device having a plurality of epitaxial layers on a substrate. The plurality of epitaxial layers include an active region in which light is able to be generated. The method comprises applying at least one first ohmic contact layer to a front surface of the epitaxial layer, the first ohmic contact layer also acting as a reflector. The substrate is then remove from a rear surface of the epitaxial layers. The rear surface is then textured.
Public/Granted literature
- US20080128722A1 Fabrication of Semiconductor Devices Public/Granted day:2008-06-05
Information query
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