发明授权
- 专利标题: Spectrum based endpointing for chemical mechanical polishing
- 专利标题(中): 基于光谱的化学机械抛光终点
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申请号: US11213344申请日: 2005-08-26
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公开(公告)号: US07764377B2公开(公告)日: 2010-07-27
- 发明人: Dominic J. Benvegnu , Jeffrey Drue David , Bogdan Swedek
- 申请人: Dominic J. Benvegnu , Jeffrey Drue David , Bogdan Swedek
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Fish & Richardson
- 主分类号: G01B11/00
- IPC分类号: G01B11/00
摘要:
Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.
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