Invention Grant
US07765675B2 CPP read sensors having constrained current paths made of lithographically-defined conductive vias and methods of making the same
有权
CPP读取具有由光刻定义的导电通孔制成的约束电流路径的传感器及其制造方法
- Patent Title: CPP read sensors having constrained current paths made of lithographically-defined conductive vias and methods of making the same
- Patent Title (中): CPP读取具有由光刻定义的导电通孔制成的约束电流路径的传感器及其制造方法
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Application No.: US11219108Application Date: 2005-09-01
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Publication No.: US07765675B2Publication Date: 2010-08-03
- Inventor: Jeffrey Robinson Childress , Jordan Asher Katine
- Applicant: Jeffrey Robinson Childress , Jordan Asher Katine
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Rambod Wader
- Agent John J. Oskorep, Esq.
- Main IPC: G11B5/187
- IPC: G11B5/187 ; B44C1/22

Abstract:
Current-perpendicular-to-plane (CPP) read sensors for magnetic heads having constrained current paths made of lithographically-defined conductive vias, and methods of making the same, are disclosed. In one example, a sensor stack structure which includes an electrically conductive spacer layer is formed over a first shield layer. An insulator layer is deposited over and adjacent the spacer layer, and a resist structure which exposes one or more portions of the insulator layer is formed over the insulator layer. With the resist structure in place, the exposed insulator layer portions are removed by etching to form one or more apertures through the insulator layer down to the spacer layer. Electrically conductive materials are subsequently deposited within the one or more apertures to form one or more lithographically-defined conductive vias of a current-constraining structure.
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