Invention Grant
- Patent Title: Method of producing printed circuit board incorporating resistance element
- Patent Title (中): 制造电阻元件的印刷电路板的制造方法
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Application No.: US11979890Application Date: 2007-11-09
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Publication No.: US07765680B2Publication Date: 2010-08-03
- Inventor: Garo Miyamoto
- Applicant: Garo Miyamoto
- Applicant Address: JP Tokyo-To
- Assignee: Nippon Mektron, Ltd.
- Current Assignee: Nippon Mektron, Ltd.
- Current Assignee Address: JP Tokyo-To
- Agency: Jacobson Holman PLLC
- Priority: JP2006-312959 20061120
- Main IPC: H01C17/06
- IPC: H01C17/06

Abstract:
There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.
Public/Granted literature
- US20080115886A1 Method of producing printed circuit board incorporating resistance element Public/Granted day:2008-05-22
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