Invention Grant
- Patent Title: Method for mechanical packaging of electronics
- Patent Title (中): 电子机械封装方法
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Application No.: US11503874Application Date: 2006-08-11
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Publication No.: US07765687B2Publication Date: 2010-08-03
- Inventor: Lennart Pitzele , Abram P. Dancy , Leif E. LaWhite , Rene Hemond , Martin F. Schlecht
- Applicant: Lennart Pitzele , Abram P. Dancy , Leif E. LaWhite , Rene Hemond , Martin F. Schlecht
- Applicant Address: US MA Boxborough
- Assignee: SynQor, Inc.
- Current Assignee: SynQor, Inc.
- Current Assignee Address: US MA Boxborough
- Agency: Hamilton, Brook, Smith & Reynolds, P.C.
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K7/20 ; H05K13/00
Abstract:
Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.
Public/Granted literature
- US20070089293A1 Mechanical packaging of electronics Public/Granted day:2007-04-26
Information query
