Invention Grant
US07765690B2 Process for fabricating electronic components and electronic components obtained by this process
失效
用于制造通过该方法获得的电子部件和电子部件的工艺
- Patent Title: Process for fabricating electronic components and electronic components obtained by this process
- Patent Title (中): 用于制造通过该方法获得的电子部件和电子部件的工艺
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Application No.: US10599127Application Date: 2005-03-21
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Publication No.: US07765690B2Publication Date: 2010-08-03
- Inventor: Travis Wade , Jean-Eric Wegrowe
- Applicant: Travis Wade , Jean-Eric Wegrowe
- Applicant Address: FR Palalseau Cedex
- Assignee: Ecole Polytechnique DGAR
- Current Assignee: Ecole Polytechnique DGAR
- Current Assignee Address: FR Palalseau Cedex
- Agency: Miller, Matthias & Hull
- Priority: FR0402998 20040323
- International Application: PCT/FR2005/000682 WO 20050321
- International Announcement: WO2005/098989 WO 20051020
- Main IPC: H05K3/02
- IPC: H05K3/02
Abstract:
The invention relates to a method for producing electronic components consisting in carrying out a first anodization of a carrier material (1) for forming at least one first pore (3) extending in a first direction in said carrier material (1) and in carrying out a second anodization for forming at least one second pore (17) extending in the carrier material (1) in a second direction different from the first direction.
Public/Granted literature
- US20070281385A1 Process For Fabricating Electronic Components And Electronic Components Obtained By This Process Public/Granted day:2007-12-06
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