Invention Grant
- Patent Title: Modular power pack assembly
- Patent Title (中): 模块化电源组件
-
Application No.: US11934559Application Date: 2007-11-02
-
Publication No.: US07765847B2Publication Date: 2010-08-03
- Inventor: Richard D. Michonski
- Applicant: Richard D. Michonski
- Applicant Address: US CO Broomfield
- Assignee: Flextronics AP, LLC
- Current Assignee: Flextronics AP, LLC
- Current Assignee Address: US CO Broomfield
- Agency: Marsh Fischmann & Breyfogle LLP
- Agent Robert G. Crouch; Russell T. Manning
- Main IPC: B21D45/06
- IPC: B21D45/06

Abstract:
Provided herein are pressure modules for use with die pressing operations for stripping work pieces from individual dies. The pressure modules include a top plate and a transfer plate that is separated by a resilient member that is compressed when a die set is closed and which provides a restoring force when the die set is opened. The pressure modules are formed independent of the dies and supported relative to the ram or press-bed of the press. In this regard, transfer pins may be utilized to transfer the restoring force from the resilient member to a stripper mechanism. In another arrangement, a press is provided that allows the pressure modules to be removed from or inserted into the press without removing a die attached to the press.
Public/Granted literature
- US20080105022A1 MODULAR POWER PACK ASSEMBLY Public/Granted day:2008-05-08
Information query