Invention Grant
- Patent Title: Method of adhesion measurement at the interface between layers
- Patent Title (中): 层间界面粘附测量方法
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Application No.: US10561579Application Date: 2003-10-31
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Publication No.: US07765861B2Publication Date: 2010-08-03
- Inventor: Jean Philippe Jacquemin
- Applicant: Jean Philippe Jacquemin
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP02292769 20021106
- International Application: PCT/IB03/04883 WO 20031031
- International Announcement: WO2004/042373 WO 20040521
- Main IPC: G01N19/04
- IPC: G01N19/04
Abstract:
The strength of adhesion between two layers is evaluated by applying a series of laser shocks directly to the surface of one of the layers. Adhesion strength is determined based on the wavelength and energy of the laser pulse creating the shock which causes rupture of the interface between the two layers.
Public/Granted literature
- US20090241656A1 Method of adhesion measurement at the interface between layers Public/Granted day:2009-10-01
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