Invention Grant
- Patent Title: Method of forming through-hole and through-hole forming machine
- Patent Title (中): 形成通孔和通孔成型机的方法
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Application No.: US11287346Application Date: 2005-11-28
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Publication No.: US07765906B2Publication Date: 2010-08-03
- Inventor: Eizou Ueno
- Applicant: Eizou Ueno
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: JP2004-362305 20041215
- Main IPC: B23D21/14
- IPC: B23D21/14

Abstract:
The method of forming a through-hole is capable of preventing formation of burrs, improving machining efficiency and reducing machining cost. The method of forming a through-hole in a circular wall of a cylindrical part of a work piece comprises the steps of: setting the work piece in a die; inserting a punch, which is provided to a rod-shaped metal core and whose length projected from the metal core is shorter than thickness of the circular wall, into the cylindrical part; relatively pressing and moving the punch toward the die so as to drive the punch into an inner face of the circular wall and bore the through-hole; sucking a scrap, which is formed by boring the through-hole, via a discharge hole of the die.
Public/Granted literature
- US20060123872A1 Method of forming through-hole and through-hole forming machine Public/Granted day:2006-06-15
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