Invention Grant
- Patent Title: Spin chuck sensing apparatus for spin coating unit
- Patent Title (中): 用于旋涂单元的旋转夹头感测装置
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Application No.: US11687117Application Date: 2007-03-16
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Publication No.: US07765950B2Publication Date: 2010-08-03
- Inventor: Do-Gyun Lee
- Applicant: Do-Gyun Lee
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2006-0045473 20060522
- Main IPC: B05C13/02
- IPC: B05C13/02 ; B05C11/00 ; B05C11/02

Abstract:
An apparatus for sensing a spin chuck for a spin coating unit includes a spin chuck which sucks a wafer with vacuum pressure to allow the wafer to be placed thereon, a rotary shaft which is rotated by driving of a motor below the spin chuck correspondingly thereto, and whose upper end is engaged with the spin chuck so as to interlock with the rotation of the spin chuck and a shaft guide shaped so as to surround a tubular stationary shaft of the spin chuck engaged with the rotary shaft. The apparatus further includes a sensing unit which senses whether or not the stationary shaft of the spin chuck is inserted into the shaft guide to a predetermined height a control unit which determines whether or not the spin chuck has been assembled normally from a signal sensed by the sensing unit and a notifying means which is controlled by the control unit to allow a user to recognize an assembled state of the spin chuck.
Public/Granted literature
- US20070266935A1 SPIN CHUCK SENSING APPARATUS FOR SPIN COATING UNIT Public/Granted day:2007-11-22
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