Invention Grant
- Patent Title: Substrate treatment apparatus
- Patent Title (中): 基板处理装置
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Application No.: US11816648Application Date: 2007-08-20
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Publication No.: US07766021B2Publication Date: 2010-08-03
- Inventor: Yoshiaki Kurokawa , Koichi Higuchi
- Applicant: Yoshiaki Kurokawa , Koichi Higuchi
- Applicant Address: JP Kanagawa
- Assignee: Shibaura Mechatronics Corporation
- Current Assignee: Shibaura Mechatronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Volpe and Koenig, P.C.
- Priority: JP2005-345580 20051130
- Main IPC: B08B3/10
- IPC: B08B3/10

Abstract:
A substrate treatment apparatus, which treats a substrate with a treatment liquid that is ultrasonically vibrated, includes an oscillator body which is rectangular-parallelepiped and has a treatment liquid supply path having an opening on a lower surface thereof in a first end portion in a longitudinal direction thereof and inclining to a second end portion in the longitudinal direction thereof, a vibrator which is provided on an upper surface of the oscillator body and ultrasonically vibrates the oscillator, and a heat exchanger which cools the treatment liquid supplied to the treatment liquid supply path.
Public/Granted literature
- US20090071511A1 SUBSTRATE TREATMENT APPARATUS Public/Granted day:2009-03-19
Information query
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