Invention Grant
- Patent Title: Temperature control of a bonding stage
- Patent Title (中): 粘合阶段的温度控制
-
Application No.: US12113537Application Date: 2008-05-01
-
Publication No.: US07766211B2Publication Date: 2010-08-03
- Inventor: Ka Shing Kenny Kwan , Gang Ou , Yong Wang , Man Chan
- Applicant: Ka Shing Kenny Kwan , Gang Ou , Yong Wang , Man Chan
- Applicant Address: SG Singapore
- Assignee: ASM Technology Singapore Pte Ltd
- Current Assignee: ASM Technology Singapore Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Ostrolenk Faber LLP
- Main IPC: B23K37/00
- IPC: B23K37/00
Abstract:
A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution system. The air distribution system is connected to the air inlet for receiving air from the air inlet, and is operative to pass the air over multiple surfaces of the bonding stage for the purpose of temperature control.
Public/Granted literature
- US20080271851A1 TEMPERATURE CONTROL OF A BONDING STAGE Public/Granted day:2008-11-06
Information query
IPC分类:
