Invention Grant
- Patent Title: Spool wound with a gold alloy wire used for a bonding process
- Patent Title (中): 线圈缠绕有用于粘合工艺的金合金线
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Application No.: US12233201Application Date: 2008-09-18
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Publication No.: US07766212B2Publication Date: 2010-08-03
- Inventor: Dong-Ik Yang , Eun-Kyun Chung , Joong-Geun Shin , Nam-Kwon Cho
- Applicant: Dong-Ik Yang , Eun-Kyun Chung , Joong-Geun Shin , Nam-Kwon Cho
- Applicant Address: DE Hanau
- Assignee: W.C. Heraeus GmbH
- Current Assignee: W.C. Heraeus GmbH
- Current Assignee Address: DE Hanau
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: KR10-2007-0094711 20070918
- Main IPC: B23K37/00
- IPC: B23K37/00 ; B65H75/14

Abstract:
A spool includes a body and a chromium layer. The body integrally includes a first portion having an annular shape and a second portion having a tubular shape. The body is formed using plastic. The first portion is provided on both sides of the second portion. The chromium layer is plated on the body. The chromium layer has a uniform thickness of about 0.1 μm to about 100 μm. A gold alloy wire is wound on the chromium layer. The chromium layer has a glossy surface. The spool is combined with a bonding device such that the spool electrically connects the bonding device to the gold alloy wire wound on the chromium layer. The shape of the spool is not easily changed by an external impact. When the gold alloy wire is wound on the spool, a scratch is not formed on the spool. Furthermore, the cost required for forming the spool is relatively small so that the spool may be used as an expendable supply. As a result, a recycling process is not required.
Public/Granted literature
- US20090072063A1 Spool Wound with a Gold Alloy Wire Used for a Bonding Process Public/Granted day:2009-03-19
Information query
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