Invention Grant
- Patent Title: Temperature sensor mounting structure and battery module structure
- Patent Title (中): 温度传感器安装结构和电池模块结构
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Application No.: US11912449Application Date: 2006-04-28
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Publication No.: US07766544B2Publication Date: 2010-08-03
- Inventor: Kentaro Shibuya , Naoki Maruno , Atsushi Mizutani , Toshiyuki Matsuoka
- Applicant: Kentaro Shibuya , Naoki Maruno , Atsushi Mizutani , Toshiyuki Matsuoka
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2005-131858 20050428; JP2005-174994 20050615
- International Application: PCT/JP2006/309056 WO 20060428
- International Announcement: WO2006/118281 WO 20061109
- Main IPC: G01K1/08
- IPC: G01K1/08 ; G01K1/14 ; G01K7/00 ; G01K13/00
Abstract:
A temperature sensor mounting structure for a battery module that is formed by connecting single cells together in series including: a temperature-measuring device that detects the temperature of the battery module; a covering device that covers the temperature-measuring device; and movement-restricting devices that are removably engaged with the battery module and restrict the movement of the covering device.
Public/Granted literature
- US20090022206A1 TEMPERATURE SENSOR MOUNTING STRUCTURE AND BATTERY MODULE STRUCTURE Public/Granted day:2009-01-22
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