Invention Grant
- Patent Title: Connector module and method of manufacturing the same
- Patent Title (中): 连接器模块及其制造方法
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Application No.: US11622503Application Date: 2007-01-12
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Publication No.: US07766560B2Publication Date: 2010-08-03
- Inventor: Jochen Dangelmaier , Stefan Paulus , Cyrus Ghahremani , Uwe Schindler , Rudolf Siegfried Lehner
- Applicant: Jochen Dangelmaier , Stefan Paulus , Cyrus Ghahremani , Uwe Schindler , Rudolf Siegfried Lehner
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Banner & Witcoff, Ltd.
- Priority: DE102006061722 20061228
- Main IPC: G02B6/36
- IPC: G02B6/36

Abstract:
A connector module (31, 71) has a base body (21) having a first contact (27) for electrically contacting an optoelectronic module (72) to be positioned into a depression (36) in the base body, a second contact (25) for electronically contacting a board, and a conductive trace (23) for electrically connecting the first (27) and second (25) contacts on a surface of the base body (21), and a molded part (33), the molded part (33) being cast onto the base body (21) across a first part of the surface, and the base body (21) and/or the molded part (33) defining a through-opening (13, 19, 37) for introducing a fiber (73). The base body (21) and the molded part (33) form two jaws for gripping the fiber (73).
Public/Granted literature
- US20080160828A1 Connector module and method of manufacturing the same Public/Granted day:2008-07-03
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