Invention Grant
- Patent Title: Contact lithography apparatus, system and method
- Patent Title (中): 接触光刻设备,系统和方法
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Application No.: US11203551Application Date: 2005-08-12
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Publication No.: US07766640B2Publication Date: 2010-08-03
- Inventor: Duncan R. Stewart , Wei Wu
- Applicant: Duncan R. Stewart , Wei Wu
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G03B27/02
- IPC: G03B27/02 ; G03B27/62

Abstract:
A contact lithography apparatus, system and method use a deformation to facilitate pattern transfer. The apparatus, system and method include a spacer that provides a spaced apart parallel and proximal orientation of lithographic elements, such as a mask and a substrate, when in mutual contact with the spacer. One or more of the mask, the substrate and the spacer is deformable, such that deformation thereof facilitates the pattern transfer.
Public/Granted literature
- US20100021577A1 Contact lithography apparatus, system and method Public/Granted day:2010-01-28
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