Invention Grant
US07766641B2 Three dimensional (3D) printer system with placement and curing mechanisms 有权
具有放置和固化机构的三维(3D)打印机系统

  • Patent Title: Three dimensional (3D) printer system with placement and curing mechanisms
  • Patent Title (中): 具有放置和固化机构的三维(3D)打印机系统
  • Application No.: US11775160
    Application Date: 2007-07-09
  • Publication No.: US07766641B2
    Publication Date: 2010-08-03
  • Inventor: Kia Silverbrook
  • Applicant: Kia Silverbrook
  • Applicant Address: AU Balmain, New South Wales
  • Assignee: Silverbrook Research Pty Ltd
  • Current Assignee: Silverbrook Research Pty Ltd
  • Current Assignee Address: AU Balmain, New South Wales
  • Priority: AU2003900180 20030116
  • Main IPC: B28B1/16
  • IPC: B28B1/16
Three dimensional (3D) printer system with placement and curing mechanisms
Abstract:
A printer system is provided for developing a three dimensional (3D) printed structure. The system includes a plurality of spaced apart sets of printing devices. A conveyor system is arranged to serially convey a print medium operatively with respect to each set so that printed voxels from each successive set can form successive layers of the 3D printed structure upon the print medium. A placement mechanism is configured to place an object upon layers of the 3D printed structure. The placement mechanism includes a translation mechanism configured to translate the object at substantially the same velocity as the conveyance of the print medium during placement of the object. A plurality of curing mechanisms is interleaved between the sets of printing devices and is configured to cure the printed voxels.
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