Invention Grant
- Patent Title: Heat transfer member and connector
- Patent Title (中): 传热部件和连接器
-
Application No.: US12211300Application Date: 2008-09-16
-
Publication No.: US07766661B2Publication Date: 2010-08-03
- Inventor: Akira Kuwahara , Takuya Takahashi , Seiya Takahashi , Hiroshi Akimoto , Hiroshi Endo , Yoshiaki Ishiyama
- Applicant: Akira Kuwahara , Takuya Takahashi , Seiya Takahashi , Hiroshi Akimoto , Hiroshi Endo , Yoshiaki Ishiyama
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry Limited
- Current Assignee: Japan Aviation Electronics Industry Limited
- Current Assignee Address: JP Tokyo
- Agency: Frishauf, Holtz, Goodman & Chick, P.C.
- Priority: JP2007-240503 20070918
- Main IPC: H01R9/09
- IPC: H01R9/09

Abstract:
A heat transfer member which is capable of enhancing efficiency of heat dissipation, and a connector including the heat transfer member. On the surface of an elastic body arranged between an LED and a heat sink, a heat conduction metal thin film that transfers heat generated in the LED to the heat sink is formed. The member may also include an electrical conduction metal film, whereby the member may serve as both a heat transfer member and as an electrical connector.
Public/Granted literature
- US20090075515A1 HEAT TRANSFER MEMBER AND CONNECTOR Public/Granted day:2009-03-19
Information query