Invention Grant
- Patent Title: Printed circuit board direct connection and method of forming the same
- Patent Title (中): 印刷电路板直接连接及其形成方法
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Application No.: US12364445Application Date: 2009-02-02
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Publication No.: US07766665B2Publication Date: 2010-08-03
- Inventor: Fred Jessup , Erik Cegnar , Mike Maughan , David G. Alexander
- Applicant: Fred Jessup , Erik Cegnar , Mike Maughan , David G. Alexander
- Applicant Address: US ID Moscow
- Assignee: IVUS Industries, Inc.
- Current Assignee: IVUS Industries, Inc.
- Current Assignee Address: US ID Moscow
- Agency: Dykas, Shaver & Nipper, LLP
- Agent Stephen M. Nipper
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00

Abstract:
A system for directly connecting multiple printed circuit boards (PCB) circuits without the need for peripheral connectors. Multiple PCBs are electrically and mechanically interfaced with one or more plated holes or tabs on at least one first PCB and one or more plated tabs or holes on at least one second PCB. The plated tab(s)/hole(s) from said second PCB mate with the corresponding plated tab(s)/hole(s) from said first PCB to form a mechanical and electrical interconnect.
Public/Granted literature
- US20090197435A1 PRINTED CIRCUIT BOARD DIRECT CONNECTION AND METHOD OF FORMING THE SAME Public/Granted day:2009-08-06
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