A thin profile electrical connector assembly for interconnecting conductive components, such as circuit boards, in a stacked configuration, includes a frame-shaped insulating body member having opposite ends and opposite leg members. A plurality of adjacently disposed and spaced apart connector elements are configured on at least one of the leg members. Each connector element includes a lower arm held in the leg member and that terminates at a contact tail that extends outward from an outer side of the leg member, and a resilient arm that extends from the lower arm at an obtuse angle towards the opposite leg member. The resilient arm terminates in a resilient contact nose that extends above an upper surface of the leg members. The insulating body defines an open space between the opposite leg members whereby the resilient arms of the connector elements are pressed into the open space upon use of the connector assembly such that the connector assembly has a profile height in use that corresponds essentially to the thickness of the leg members.