An electrical connection device is used for electrically connecting an electronic element having solder balls, and includes an insulating body and a plurality of pins. The insulating body has a plurality of receiving slots formed by a plurality of first rib boards and second rib boards respectively and crossly disposed along the X and Y-coordinate direction. Each pin has a base portion extending upwardly to form a first and a second flexible arm. The end of the first and the second flexible arm respectively form a first contact portion and a second contact portion. At least one of the receiving slots receives the first flexible arm of the pin and the second flexible arm of another pin. The first and the second contact portion located in the same receiving slot are disposed staggered in an upper and a lower location along the X-coordinate direction and not connected to each other.