Invention Grant
US07766671B2 Electronic component and method of forming the same 有权
电子元件及其形成方法

Electronic component and method of forming the same
Abstract:
An electronic component includes a substrate, an interconnection element, and a connector. The interconnection element has conductivity. The interconnection element is present over the substrate. The connector is present on the interconnection element. The connector may further include, but is not limited to, a base, at least one stopper, and at least one sloped guiding surface. The base projects from the interconnection element in a first direction that is vertical to the surface of the substrate. At least one stopper projects from the base in a second direction that is parallel to the surface of the substrate. The one stopper has a stopper surface.
Public/Granted literature
Information query
Patent Agency Ranking
0/0