Invention Grant
- Patent Title: Electronic component and method of forming the same
- Patent Title (中): 电子元件及其形成方法
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Application No.: US12171856Application Date: 2008-07-11
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Publication No.: US07766671B2Publication Date: 2010-08-03
- Inventor: Atsuo Hattori
- Applicant: Atsuo Hattori
- Applicant Address: JP Shizuoka, Ken
- Assignee: Yamaha Corporation
- Current Assignee: Yamaha Corporation
- Current Assignee Address: JP Shizuoka, Ken
- Agency: Dickstein Shapiro LLP
- Priority: JP2007-183494 20070712
- Main IPC: H01R9/00
- IPC: H01R9/00

Abstract:
An electronic component includes a substrate, an interconnection element, and a connector. The interconnection element has conductivity. The interconnection element is present over the substrate. The connector is present on the interconnection element. The connector may further include, but is not limited to, a base, at least one stopper, and at least one sloped guiding surface. The base projects from the interconnection element in a first direction that is vertical to the surface of the substrate. At least one stopper projects from the base in a second direction that is parallel to the surface of the substrate. The one stopper has a stopper surface.
Public/Granted literature
- US20090017670A1 ELECTRONIC COMPONENT AND METHOD OF FORMING THE SAME Public/Granted day:2009-01-15
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