Invention Grant
- Patent Title: Cover attaching structure, housing and cover
- Patent Title (中): 盖结构，外壳和盖
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Application No.: US12204652Application Date: 2008-09-04
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Publication No.: US07766683B2Publication Date: 2010-08-03
- Inventor: Toru Nagano , Hideki Honma
- Applicant: Toru Nagano , Hideki Honma
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-228834 20070904
- Main IPC: H01R13/62
- IPC: H01R13/62
Abstract:
A cover attaching structure in a connector includes: first and second locking portions provided on a first attaching member; and third and fourth locking portions provided on a second attaching member which is attached to the first attaching member. The first locking portion is locked on the third locking portion from an outer surface side of the connector. The second locking portion is locked on the fourth locking portion from an inner surface side of the connector.
Public/Granted literature
- US20090061672A1 COVER ATTACHING STRUCTURE, HOUSING AND COVER Public/Granted day:2009-03-05
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