Invention Grant
- Patent Title: Pluggable form factor release mechanism
- Patent Title (中): 可插拔式外形释放机构
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Application No.: US12008094Application Date: 2008-01-07
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Publication No.: US07766686B2Publication Date: 2010-08-03
- Inventor: Xiao-Bai Gu
- Applicant: Xiao-Bai Gu
- Applicant Address: US TX Sugar Land
- Assignee: Applied Optoelectronics, Inc.
- Current Assignee: Applied Optoelectronics, Inc.
- Current Assignee Address: US TX Sugar Land
- Agency: Grossman, Tucker, Perrault & Pfleger PLLC
- Agent Norman Stephan Kinsella
- Main IPC: H01R13/62
- IPC: H01R13/62

Abstract:
Briefly, various embodiments of a pluggable form factor release mechanism are described. For example, but without intending to limit the scope of claimed subject matter, a transceiver module may include the following: a module housing; a bail lever; an actuator; and a spring adjacent to the actuator. The bail lever and the actuator may be movably connected to the module housing in such a manner so that pivoting the bail lever away from the housing engages an end of the actuator to move towards the module housing. The actuator may rotate about a fulcrum with an opposing end of the actuator moving away from the module housing.
Public/Granted literature
- US20090176401A1 Pluggable form factor release mechanism Public/Granted day:2009-07-09
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