Invention Grant
- Patent Title: Conductor connection
- Patent Title (中): 导体连接
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Application No.: US11778755Application Date: 2007-07-17
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Publication No.: US07766702B2Publication Date: 2010-08-03
- Inventor: Robert V. De France , Daniel D. Dobrinski , Bernard C. Crutcher
- Applicant: Robert V. De France , Daniel D. Dobrinski , Bernard C. Crutcher
- Applicant Address: US NH Manchester
- Assignee: Burndy Technology LLC
- Current Assignee: Burndy Technology LLC
- Current Assignee Address: US NH Manchester
- Agency: Harrington & Smith
- Main IPC: H01R4/50
- IPC: H01R4/50

Abstract:
Disclosed herein is an electrical connector frame member. The electrical connector frame member includes a first leg section, a conductor receiving section, and a wedge section. The first leg section is configured to be connected to an electrical isolator. The conductor receiving section is connected to the first leg section. The conductor receiving section is configured to receive an electrical conductor. The wedge section extends from the conductor receiving section. The wedge section is integrally formed with the conductor receiving section and comprises a wedge connector shell contact surface. The wedge connector shell contact surface is angled relative to the conductor receiving section.
Public/Granted literature
- US20080026644A1 Conductor Connection Public/Granted day:2008-01-31
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