Invention Grant
US07767025B2 Nozzle array configuration to facilitate deflux process improvement in chip attach process
有权
喷嘴阵列配置方便芯片连接过程中的脱屑工艺改进
- Patent Title: Nozzle array configuration to facilitate deflux process improvement in chip attach process
- Patent Title (中): 喷嘴阵列配置方便芯片连接过程中的脱屑工艺改进
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Application No.: US11865057Application Date: 2007-09-30
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Publication No.: US07767025B2Publication Date: 2010-08-03
- Inventor: Harikrishnan Ramanan , Yongqian J. Wang
- Applicant: Harikrishnan Ramanan , Yongqian J. Wang
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Konrad Raynes & Victor LLP
- Agent Alan S. Raynes
- Main IPC: B08B7/04
- IPC: B08B7/04 ; B08B1/02 ; B08B3/02

Abstract:
Systems and methods for treating workpieces are described. One embodiment relates to a deflux system including at least one array of nozzles, the nozzles adapted to transmit a fluid outward therefrom. The nozzles are moveable relative to one another, so that a distance between adjacent nozzles can be varied. The nozzles are individually adjustable with respect to an angle of spray emitted therefrom during operation. The system also includes a controller adapted to send a signal to each of the nozzles to transmit the fluid therethrough at a desired angle at a desired time. Other embodiments are described and claimed.
Public/Granted literature
- US20090084412A1 NOZZLE ARRAY CONFIGURATION TO FACILITATE DEFLUX PROCESS IMPROVEMENT IN CHIP ATTACH PROCESS Public/Granted day:2009-04-02
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