Invention Grant
US07767025B2 Nozzle array configuration to facilitate deflux process improvement in chip attach process 有权
喷嘴阵列配置方便芯片连接过程中的脱屑工艺改进

Nozzle array configuration to facilitate deflux process improvement in chip attach process
Abstract:
Systems and methods for treating workpieces are described. One embodiment relates to a deflux system including at least one array of nozzles, the nozzles adapted to transmit a fluid outward therefrom. The nozzles are moveable relative to one another, so that a distance between adjacent nozzles can be varied. The nozzles are individually adjustable with respect to an angle of spray emitted therefrom during operation. The system also includes a controller adapted to send a signal to each of the nozzles to transmit the fluid therethrough at a desired angle at a desired time. Other embodiments are described and claimed.
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