Invention Grant
US07767069B2 Method for controlling the contact angle of a droplet in electrowetting and an apparatus using the droplet formed thereby
有权
用于控制电润湿中的液滴的接触角的方法和使用由此形成的液滴的装置
- Patent Title: Method for controlling the contact angle of a droplet in electrowetting and an apparatus using the droplet formed thereby
- Patent Title (中): 用于控制电润湿中的液滴的接触角的方法和使用由此形成的液滴的装置
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Application No.: US11536319Application Date: 2006-09-28
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Publication No.: US07767069B2Publication Date: 2010-08-03
- Inventor: Jeong Gun Lee , Hye Jung Cho , Nam Huh , Sung Jae Kim
- Applicant: Jeong Gun Lee , Hye Jung Cho , Nam Huh , Sung Jae Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2005-0090486 20050928
- Main IPC: G01N27/447
- IPC: G01N27/447
Abstract:
A method for controlling the hydrophilic droplet using the electrowetting principle is disclosed. More specifically, the present invention provides a method for increasing the change of the contact angle in the interface that is formed between the hydrophilic droplet and the nonpolar fluid by adding a constant concentration of two-element electrolyte or three-element electrolyte to the hydrophilic droplet; and an apparatus for controlling the droplet having the change of the contact angle and velocity scope increased by the method.
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