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US07767106B2 Method of dry etching oxide semiconductor film 有权
干蚀刻氧化物半导体膜的方法

Method of dry etching oxide semiconductor film
Abstract:
Provided is a dry etching method for an oxide semiconductor film containing at least In, Ga, and Zn, which includes etching an oxide semiconductor film in a gas atmosphere containing a halogen-based gas.
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